Date: 29 November – 3 December 2021
Venue: Bali, Indonesia
Schedule: To be announced 

Count Every Second
Until The Event.


As global calls for a 50% reduction in greenhouse gases by 2050 become more prevalent, scientists and engineers face a daunting task of addressing this problem. Heat pump-related technology has been widely applied to refrigeration, air conditioning, hot water supply, and various other industrial technologies as an energy-saving Cooling/heating control technology, and its applications are expected to expand further.

In recent years, heat pump technology has been recognized as a key technology to control Temperature against extreme atmospheric warming, thereby preventing heat stroke and Safeguarding people from viruses which often become drug resistant. As the core Technology in cold chain logistics, it also enables safe and secure food supply by maintaining low temperatures and controlling humidity throughout the logistics process. Heat pump-related technology has evolved to protect our lives through temperature control, while helping to protect the environment against global warming by reducing energy consumption.

However, heat pump technology also has the problems of ozone depletion and global warming associated with refrigerants. Discussion regarding these problems is often skewed by government and industry self-interest, making it difficult to identify core issues. It is necessary for both manufacturers and users to break down “silo mentalities” and engage in evidence-based discussion to determine the best path forward. It is also important to involve academics as a third party with both theoretical and practical knowledge.

Therefore, we have planned a new form of conference. In addition to conventional academic discussion, this conference offers opportunities for various types of meetings to facilitate discussion among businesses, and between business and academia. We hope that lively discussion among various players in this conference will lead to further development and popularization of heat pump-related technology. We look forward to your active participation.

Kiyoshi Saito